With its capacity, technology, and expert team, Özdisan offers its customers the highest quality electronic card assembly service in the facilities belonging to its group companies. In these facilities, many processes, including soldering in a nitrogen environment, 3D automated optical inspection (3D AOI), 3D solder paste inspection (3D SPI), conformal coating, automatic local soldering, and PCB-A washing are carried out at IPC 610 Class 3 level with the help of X-ray devices, environmental test cabins, BGA repair stations, and humidity cabins.
We manufacture at our factories in Ankara and Istanbul (which have a total surface area of 7.500 m2 ESD protected areas) and register raw materials in our ERP system through our processes complying with IPC- A-600 standards to provide traceability at every stage.
We identify all electronic boards with laser markers or labels. This way, we register our manufacturing processes and match the PCB-As with raw materials. With our MES infrastructure, we keep our manufacturing process under control by providing “end-to-end” traceability at all stages.
We store the solder paste under special conditions and prepare it for the manufacturing process. We confirm the suitability of the solder paste via RPA (Robotic Process Automation) and, after such confirmation, carry out the soldering process with a Stencil.
We verify all solder paste processes with the 3D Solder Paste Inspection System. After the approval from this system, we move on to the manufacturing process and ensure quality at every stage.
After the Feeder and SMD machine installation, we carry out assembly operations with our SMD typesetting machines (which have a manufacturing capacity of 1 million components per hour).
While the solder paste is being cured, we connect thermocouples to the specific points on the PCB. We determine the temperature and conveyor speed with reference to the IPC-7530 standards and ensure the optimal soldering conditions with nitrogen and vacuum options.
We inspect the products (whose assembly and soldering operations have been completed) with 3D Automatic Optical Inspection systems. This system uses three different resolution cameras (7µm, 12µm, 18µm) that analyze the correct assembly of all materials and whether the soldering meets the IPC criteria.
We use systems that check the assembly and soldering of electronic materials (BGA, QFN, DFN) under the body of the soldering surface. We image the materials with X-ray technology, check whether they comply with IPC standards via special algorithms, and carry out a 3D analysis.
We carry out the assembly of THT (through-hole assembly) materials on radial and axial axes automatically. These systems are capable of assembling 25,000 components per hour.
Thanks to our regional soldering machines, we ensure the automatic soldering of THT materials with a precise robotic application. With this system, a stable solder quality complying with IPC standards is guaranteed on the boards that have SMD material on both surfaces.
We manually place the THT materials that require manual assembly on the circuit board. We complete the assembly process by carrying out fast and high-quality soldering with the automatic wave soldering process at the end of the tape.
With our 3D THT Automatic Optical Inspection system, we automatically inspect whether the assembly and soldering quality of THT materials on the board (PCB-A) comply with IPC standards. We do a 3D analysis and double surface imaging at three different resolutions (7µm, 12µm, 18µm).
We clean off the chemical impurities on electronic boards (PCB-A) with special cleaning chemicals and deionized water through robotic systems. We verify the cleaning results with ionic contamination tests.
We apply ICT, Flying Probe, and FCT tests to the finished electronic boards (PCB-A). We inspect each component with a special fixture and probe system and test all the measurements automatically and functionally by applying voltage to the circuits on the boards.
We carry out the process of separating PCB-A boards from manufacturing lines via CNC machines. This way, we prevent the boards and the materials on the boards from being impacted by dust or being exposed to mechanical stress.
We carry out acrylic-based chemical coating to protect the electronic boards against dust, moisture, and corrosion. We carry out this process with robotic systems following IPC standards.
We reveal any soldering or assembly defects by testing our products in hot and cold environments. We carry out conditioning tests in the temperature range of -70°C to 180°C with a temperature change of 15°C per minute.
We are testing the resistance of our products to the vibrations (which they will be exposed to) in the field. Using the vibration tester, we detect any assembly errors related to the products by applying vibration on their X, Y, and Z axes.
We carry out a conformity check on the finished products following the product specification and IPC-A-610 standards. Then, we complete the shipment processes by packaging and labeling the finished products with anti-static packages.
